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Al Yuen, CEO of PicoJool, talks with Austin about using VCSELs for scale-up optical interconnects in AI data centers. Al explains why gallium arsenide (GaAs) supply is unconstrained while indium phosp…
Vik welcomes Val Bercovici from Weka to discuss the rapidly evolving landscape of AI memory and storage. Val explains how Weka's architecture leverages high-bandwidth networks to make storage faster than motherboard DRAM…
Austin and Vik break down the current memory crisis, where AI demand is driving unprecedented profits for memory makers like Micron, while simultaneously causing inflation and price hikes for consumer electronics. They d…
Qualcomm flew Austin to New York for its investor day, where the communications company laid out a plan to make data center, automotive, and IoT two-thirds of its business by FY29. Austin was in the room and asked Cristi…
New episode: Advanced packaging for AI chips, from wire bonds to TSMC CoWOS and Intel EMIB. Packaging is no longer an afterthought. It is the chip, and Intel's EMIB challenges TSMC's CoWOS. Three CoWOS flavors: silicon,…
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